Capacidades de aquecedores flexíveis
Capacidades de PCB rígido
Capacidades de PCB flexível
Capacidades de PCBA
Capacidades de stencil
Capacidades de disposição de PCB
Aquecedor Flexível em Poliamida (Polyimid-Flexheizer)
Silicone
Category | Feature | Capability | Description |
|---|
Material & Stack-up | Heater Structure | Single-layer structure | Single-layer heating circuit, suitable for most applications. |
Material Type | Stainless steel / Copper (Brass) / FeCrAl | Laminated onto PI (Polyimide) substrates; available in 30μm / 50μm thickness. | |
PI SubstrateTemperature Resistance | -70℃ ~ 200℃; -40 ~ 300℃ (High-temperature resistant PI film) | Suitable for most medium-to-high temperature applications. | |
Dimensions & Thickness | Finished Product Size Range | Max 1200 mm × 490 mm
Min 10 mm × 10 mm
Tolerance is within ±0.5mm to ±1.0mm | Standard size is 590 mm × 490 mm; custom sizes supported up to 1200 mm × 490 mm.
Tolerance is within ±0.5mm to ±1.0mm. |
Substrate Thickness Tolerance | ±0.05 mm (limit ±0.03 mm) | Tolerance range for total material thickness measurement. | |
Circuit Processing | Etching Method | Dry film + LDI imaging / Laser etching | Laser etching suitable for alloy materials; high efficiency and precision. |
Min. track width and spacing | 0.25 mm | PI heater supports a minimum line width and spacing of 0.25 mm, ensuring circuit accuracy and reliability. | |
Min. pad size | 2 mm × 2 mm | Pad opening size should match the trace width and is intended for lead wire soldering. | |
Min. Track to outline clearance | 1mm | Prevents damage to traces during laser or die-cut processing and ensures edge strength. | |
Min. Pad to outline clearance | 1mm | Ensures mechanical strength of solder pads and prevents pad lifting near the edge. | |
Min. Hole to outline clearance | 1mm | Prevents insufficient edge strength after drilling and avoids tearing or deformation. | |
Min. Pad to track clearance | 1mm | Avoids thermal damage or short circuits during soldering or high-temperature operation. | |
Min. Pad to pad clearance | 1mm | Prevents solder bridging and improves soldering and electrical reliability. | |
Resistance Testing | Flying probe / Precision instrument full test | Ensures precision and reliability of the circuit. | |
Resistance Tolerance | ±5% | Resistance values are controlled within ±5% to ensure consistent heat output. | |
Finished Features | Hole Size Range | ≥Φ1 mm | Formed by laser or die-cutting; hole diameter tolerance is ±0.05 mm. |
Diameter Tolerance | ±0.05 mm | Recommended to keep openings at least 0.5 mm away from circuit traces. | |
Cover Layer Lamination | Laser alignment + automatic lamination | Supports window area defined in customer files. | |
Outline Cutting | Laser cutting / Die-cutting | Edge clearance ≥0.3 mm; tolerance ±0.1 mm (high-precision ±0.05 mm). | |
Wire Soldering / Glue Dispensing | Manual / Laser soldering
Automatic / Manual gluing | Supports precise automated processing. | |
3M Adhesive (Normal) | 3M9448A / 468 / 55236 | Operating temperature -40℃ ~ 160℃. | |
High-temp Adhesive | 3M9077 / Tesa 8853 | Long-term 200℃, short-term up to 240℃. | |
Wire Harness | Standard Wire | Teflon / Silicone wire | Currently only the default wire type is supported.Customer selection, JLC Parts sourcing, or Consign Parts will be supported in the future. |
Panelization | Panel Size | 250 mm × 350 mm / 250 mm × 500 mm | Supports customized panel sizes. |
Spacing & Break Tabs | 2 mm spacing /0.5–0.8 mm break tabs | Convenient for splitting and reducing defects. | |
Panel Soldering / Component Mounting | Per customer requirements | Supports wire attachment and component mounting. | |
Design Files & Guidelines | File Formats | CAD / Gerber / PDF | CAD format recommended; include pad, resistance, and trace direction. |
Power & Dimension Parameters | Provide resistance, voltage, power,target temperature | Converted into standard design drawings using calculation formulas. |
Perguntas frequentes sobre aquecedores flexíveis
Qual é a diferença entre um aquecedor de silicone e um aquecedor de PI?
O silicone é mais durável, flexível e adequado para utilização no exterior ou em ambientes exigentes. Os aquecedores de PI (poliimida) utilizam uma película fina de poliimida e são ideais para aplicações compactas que exigem leveza e controlo preciso do aquecimento.
Os aquecedores de silicone oferecem geralmente maior resistência mecânica, enquanto os aquecedores de PI proporcionam melhor controlo da espessura e uma resposta rápida.
Posso efetuar uma encomenda sem um ficheiro de projeto?
Qual é a tolerância da resistência dos aquecedores flexíveis JLC?
Que fios são normalmente utilizados para soldadura nos aquecedores flexíveis JLC?
Suportam a soldadura de termóstatos, NTC ou terminais personalizados?
Existe um intervalo recomendado de densidade de potência? O que acontece se for demasiado elevado?
