柔性加熱片製程能力
硬式 PCB 製程能力
軟性 PCB 製程能力
PCBA 製程能力
鋼板製程能力
PCB 佈局能力
PI
矽膠
Category | Feature | Capability | Description |
|---|
Material & Stack-up | Heater Structure | Single-layer structure | Single-layer heating circuit, suitable for most applications. |
Material Type | Stainless steel / Copper (Brass) / FeCrAl | Laminated onto PI (Polyimide) substrates; available in 30μm / 50μm thickness. | |
PI SubstrateTemperature Resistance | -70℃ ~ 200℃; -40 ~ 300℃ (High-temperature resistant PI film) | Suitable for most medium-to-high temperature applications. | |
Dimensions & Thickness | Finished Product Size Range | Max 1200 mm × 490 mm
Min 10 mm × 10 mm
Tolerance is within ±0.5mm to ±1.0mm | Standard size is 590 mm × 490 mm; custom sizes supported up to 1200 mm × 490 mm.
Tolerance is within ±0.5mm to ±1.0mm. |
Substrate Thickness Tolerance | ±0.05 mm (limit ±0.03 mm) | Tolerance range for total material thickness measurement. | |
Circuit Processing | Etching Method | Dry film + LDI imaging / Laser etching | Laser etching suitable for alloy materials; high efficiency and precision. |
Min. track width and spacing | 0.25 mm | PI heater supports a minimum line width and spacing of 0.25 mm, ensuring circuit accuracy and reliability. | |
Min. pad size | 2 mm × 2 mm | Pad opening size should match the trace width and is intended for lead wire soldering. | |
Min. Track to outline clearance | 1mm | Prevents damage to traces during laser or die-cut processing and ensures edge strength. | |
Min. Pad to outline clearance | 1mm | Ensures mechanical strength of solder pads and prevents pad lifting near the edge. | |
Min. Hole to outline clearance | 1mm | Prevents insufficient edge strength after drilling and avoids tearing or deformation. | |
Min. Pad to track clearance | 1mm | Avoids thermal damage or short circuits during soldering or high-temperature operation. | |
Min. Pad to pad clearance | 1mm | Prevents solder bridging and improves soldering and electrical reliability. | |
Resistance Testing | Flying probe / Precision instrument full test | Ensures precision and reliability of the circuit. | |
Resistance Tolerance | ±5% | Resistance values are controlled within ±5% to ensure consistent heat output. | |
Finished Features | Hole Size Range | ≥Φ1 mm | Formed by laser or die-cutting; hole diameter tolerance is ±0.05 mm. |
Diameter Tolerance | ±0.05 mm | Recommended to keep openings at least 0.5 mm away from circuit traces. | |
Cover Layer Lamination | Laser alignment + automatic lamination | Supports window area defined in customer files. | |
Outline Cutting | Laser cutting / Die-cutting | Edge clearance ≥0.3 mm; tolerance ±0.1 mm (high-precision ±0.05 mm). | |
Wire Soldering / Glue Dispensing | Manual / Laser soldering
Automatic / Manual gluing | Supports precise automated processing. | |
3M Adhesive (Normal) | 3M9448A / 468 / 55236 | Operating temperature -40℃ ~ 160℃. | |
High-temp Adhesive | 3M9077 / Tesa 8853 | Long-term 200℃, short-term up to 240℃. | |
Wire Harness | Standard Wire | Teflon / Silicone wire | Currently only the default wire type is supported.Customer selection, JLC Parts sourcing, or Consign Parts will be supported in the future. |
Panelization | Panel Size | 250 mm × 350 mm / 250 mm × 500 mm | Supports customized panel sizes. |
Spacing & Break Tabs | 2 mm spacing /0.5–0.8 mm break tabs | Convenient for splitting and reducing defects. | |
Panel Soldering / Component Mounting | Per customer requirements | Supports wire attachment and component mounting. | |
Design Files & Guidelines | File Formats | CAD / Gerber / PDF | CAD format recommended; include pad, resistance, and trace direction. |
Power & Dimension Parameters | Provide resistance, voltage, power,target temperature | Converted into standard design drawings using calculation formulas. |
柔性加熱片常見問題
矽膠加熱片與 PI 加熱片有何差異？
矽膠較耐用、柔軟，適合戶外或嚴苛環境。PI（聚醯亞胺）加熱片採用薄型聚醯亞胺膜，適合需要輕量化與精準加熱控制的緊湊型應用。
矽膠加熱片通常具有較高的機械強度；PI 加熱片則具備較佳的厚度控制與快速反應。
沒有設計檔案也可以下單嗎？
JLC 柔性加熱片的電阻值公差為何？
JLC 柔性加熱片焊接時常用哪些線材？
是否支援焊接溫控器、NTC 熱敏電阻或客製端子？
是否有建議的功率密度範圍？若功率密度過高會如何？
