製程能力

柔性加熱片製程能力

硬式 PCB 製程能力

軟性 PCB 製程能力

PCBA 製程能力

鋼板製程能力

PCB 佈局能力

矽膠

Materials & Construction	Heating structure	Single-layer heating conductor	Crossovers and multilayer heating conductors are not supported. Multiple independent circuits are supported, with no fixed limit on circuit quantity.
	Circuit fabrication	Etching	PI heaters use etched heating circuits only. The specific etching or laser processing method is selected by the factory according to the order.
	Heating conductor material	Stainless steel / Brass / Fe-Cr-Al alloy	The same geometric manufacturing limits apply to all three etched conductor materials.
	Etched metal thickness	30 μm / 50 μm	This is the thickness of the etched metal foil, not the PI base film or total finished-product thickness.
	Standard PI film temperature rating	-40°C to 150°C (72 h); short-term maximum 200°C (30 min)	This rating applies to the film material only. For an assembled product with adhesive, lead wires, NTC, or thermostat, the maximum operating temperature is limited by the lowest-rated component.
	High-temperature PI film rating	-40°C to 250°C (72 h); short-term maximum 280°C (30 min)	Standard and high-temperature PI use the same geometric manufacturing parameters.
	Flexibility	Bendable; best flexibility among the current product range	Suitable for curved-surface or bent installation, but repeated dynamic flexing is not recommended.
Dimensions & Thickness	Finished-product size range	Minimum 10 mm × 10 mm; maximum 1200 mm × 490 mm	Dimensions are evaluated using the minimum bounding rectangle. Both length and width must meet the minimum-size requirement.
	Standard pricing size	Long side of bounding rectangle ≤590 mm	An oversized-product surcharge applies when the long side exceeds 590 mm. A size of 590 mm × 490 mm is not a fixed product format.
	Standard outline tolerance	Long side ≤300: ±1 mm; >300–600: ±1.5 mm; >600–1000: ±2 mm; >1000–1200: ±3 mm	The tolerance tier is determined by the longer side of the product's minimum bounding rectangle. Laser cutting is excluded.
	Laser-cut outline	Outline tolerance up to ±0.3 mm; maximum bounding dimension ≤470 mm	The cut edge may show blackening. The factory determines the processing method according to internal rules; it is not a customer-selectable option.
	Finished thickness tolerance	±0.1 mm	The same ±0.1 mm tolerance applies to PI heaters with or without adhesive. A high-precision tolerance of ±0.03 mm is not guaranteed.
	Custom shapes	Regular and irregular outlines supported	Supported geometries include circles, rings, sectors, trapezoids, irregular contours, internal cutouts, multiple holes, slots, and open notches.
Circuit Design	Minimum trace width	0.25 mm	Applies to etched stainless steel, brass, and Fe-Cr-Al heating circuits.
	Minimum trace spacing	0.25 mm	Measured as the shortest edge-to-edge distance between two heating conductors.
	Recommended design range	Trace width and spacing are typically 0.25–3.5 mm	Each product must be evaluated according to resistance and routing requirements. Trace width is generally slightly greater than spacing, although spacing may also be slightly greater than trace width.
	220 V design recommendation	Recommended trace width and spacing ≥1.8 mm	This is an engineering design recommendation for 220 V applications and does not replace the minimum manufacturing capability.
	Heating conductor to outline	≥1 mm	Measured from the conductor edge to the nominal finished-product outline. The customer does not need to add outline dimensional tolerance to this clearance.
Pads	Minimum pad opening	2 mm × 2 mm	This is the coverlay opening for soldering, not the metal pad size.
	Metal overlap around opening	≥0.5 mm on each side	The opening must lie completely within the metal pad. A connected breakout trace may continue beyond the pad.
	Typical minimum metal pad	Typically ≥3 mm × 3 mm	Derived from the minimum opening and metal overlap. The actual pad is not required to be rectangular.
	Metal pad to outline	≥1 mm	Measured from the metal pad edge to the nominal finished-product outline.
	Metal pad to non-connected conductor	≥1 mm	Measured from the metal pad edge to a non-connected conductor edge. This limit does not apply to the breakout trace connected to the pad.
	Metal pad to metal pad	≥1 mm	Measured as the shortest edge-to-edge distance between two metal pads. No separate opening-to-opening requirement is specified.
Holes & Slots	Minimum finished round-hole diameter	Ø1 mm	Calculated using the finished-hole diameter.
	Minimum internal closed-slot width	1 mm	Applies to elongated and irregular holes; measured at the narrowest point of the slot contour.
	Minimum open edge-notch width	1.5 mm	Applies to notches connected to the product outline; measured at the narrowest point.
	Finished hole to outline	≥1 mm	Measured as the shortest distance from the finished-hole edge to the nominal finished-product outline.
	Finished hole to heating conductor	≥1 mm	Measured from the finished-hole edge to the heating-conductor edge.
	Hole size tolerance	±1 mm	Applies to round-hole diameter and the specified width of irregular holes or slots.
	Hole position tolerance	±1 mm	Defined separately from the hole size tolerance.
Electrical & Testing	Resistance tolerance for JLC-designed orders	Etched ≥1 Ω: ±5%; etched <1 Ω: ±8%	Measured at room temperature by connecting the instrument directly to the metal pads. Soldered lead-wire resistance is excluded. This tolerance definition has been confirmed.
	Customer-supplied drawing orders	Produced to the drawing; actual resistance tested on every piece	The customer circuit is not recalculated. Target resistance and heating performance of a customer-designed circuit are not guaranteed.
	Resistance inspection	100% in-process resistance testing + outgoing sampling inspection	An internal QC report is retained. The outgoing QC report normally shows test data for 5 pcs per batch and is not provided for every individual unit by default.
	Theoretical free-air temperature assessment	Based on 25°C ambient, still air, unbonded installation, no thermal insulation, and no forced-air cooling	The result is a theoretical reference and does not guarantee operating temperature under the customer's actual installation conditions.
Product Options	Pressure-sensitive adhesive	3M 9448A / 468 / 55236 / 9077; Tesa 8853	All listed adhesives can be used with PI. Refer to the selected model notes on the quotation page for temperature rating and price.
	Default lead wires	UL 3239 silicone wire / UL 1332 PTFE wire; red/black	Lead-wire length is selected by the customer.
	Silicone sleeve	Maximum length 2 m	The 2 m limit applies only to the sleeve, not to the maximum lead-wire length.
	NTC	SMD NTC is generally recommended; probe-type NTC is also supported	Select a part from the component library whenever possible. A JLCPCB Parts number may also be submitted for solderability review.
	Coverlay and openings	Custom pad and component openings supported	Circuit transfer, alignment lamination, and custom openings are supported. The specific process is arranged by the factory.
Files & Panelization	Customer upload formats	DXF / DWG / Gerber / PDF / JPG / PNG	Customer files are reviewed by engineering and converted into internal production files.
Files & Panelization	Recommended production panel sizes	250 mm × 350 mm / 250 mm × 500 mm	The customer submits a single-piece file and the factory completes production panelization. Internal unit spacing and breakaway-tab parameters are not published.

柔性加熱片常見問題

矽膠較耐用、柔軟，適合戶外或嚴苛環境。PI（聚醯亞胺）加熱片採用薄型聚醯亞胺膜，適合需要輕量化與精準加熱控制的緊湊型應用。

矽膠加熱片通常具有較高的機械強度；PI 加熱片則具備較佳的厚度控制與快速反應。

柔性加熱片製程能力

快速、經濟的客製化熱管理方案

柔性加熱片製程能力

Materials & Construction

Dimensions & Thickness

Circuit Design

Pads

Holes & Slots

Electrical & Testing

Product Options

Files & Panelization

柔性加熱片常見問題

矽膠加熱片與 PI 加熱片有何差異？

沒有設計檔案也可以下單嗎？

JLC 柔性加熱片的電阻值公差為何？

JLC 柔性加熱片焊接時常用哪些線材？

是否支援焊接溫控器、NTC 熱敏電阻或客製端子？

是否有建議的功率密度範圍？若功率密度過高會如何？

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