Capacités des éléments chauffants flexibles
Capacités des PCB rigides
Capacités des PCB flexibles
Capacités PCBA
Capacités des pochoirs
Capacités de conception PCB
PI
Silicone
Category | Feature | Capability | Description |
|---|
Material & Stack-up | Heater Structure | Single-layer structure | Single-layer heating circuit, suitable for most applications. |
Material Type | Stainless steel / Copper (Brass) / FeCrAl | Laminated onto PI (Polyimide) substrates; available in 30μm / 50μm thickness. | |
PI SubstrateTemperature Resistance | -70℃ ~ 200℃; -40 ~ 300℃ (High-temperature resistant PI film) | Suitable for most medium-to-high temperature applications. | |
Dimensions & Thickness | Finished Product Size Range | Max 1200 mm × 490 mm
Min 10 mm × 10 mm
Tolerance is within ±0.5mm to ±1.0mm | Standard size is 590 mm × 490 mm; custom sizes supported up to 1200 mm × 490 mm.
Tolerance is within ±0.5mm to ±1.0mm. |
Substrate Thickness Tolerance | ±0.05 mm (limit ±0.03 mm) | Tolerance range for total material thickness measurement. | |
Circuit Processing | Etching Method | Dry film + LDI imaging / Laser etching | Laser etching suitable for alloy materials; high efficiency and precision. |
Min. track width and spacing | 0.25 mm | PI heater supports a minimum line width and spacing of 0.25 mm, ensuring circuit accuracy and reliability. | |
Min. pad size | 2 mm × 2 mm | Pad opening size should match the trace width and is intended for lead wire soldering. | |
Min. Track to outline clearance | 1mm | Prevents damage to traces during laser or die-cut processing and ensures edge strength. | |
Min. Pad to outline clearance | 1mm | Ensures mechanical strength of solder pads and prevents pad lifting near the edge. | |
Min. Hole to outline clearance | 1mm | Prevents insufficient edge strength after drilling and avoids tearing or deformation. | |
Min. Pad to track clearance | 1mm | Avoids thermal damage or short circuits during soldering or high-temperature operation. | |
Min. Pad to pad clearance | 1mm | Prevents solder bridging and improves soldering and electrical reliability. | |
Resistance Testing | Flying probe / Precision instrument full test | Ensures precision and reliability of the circuit. | |
Resistance Tolerance | ±5% | Resistance values are controlled within ±5% to ensure consistent heat output. | |
Finished Features | Hole Size Range | ≥Φ1 mm | Formed by laser or die-cutting; hole diameter tolerance is ±0.05 mm. |
Diameter Tolerance | ±0.05 mm | Recommended to keep openings at least 0.5 mm away from circuit traces. | |
Cover Layer Lamination | Laser alignment + automatic lamination | Supports window area defined in customer files. | |
Outline Cutting | Laser cutting / Die-cutting | Edge clearance ≥0.3 mm; tolerance ±0.1 mm (high-precision ±0.05 mm). | |
Wire Soldering / Glue Dispensing | Manual / Laser soldering
Automatic / Manual gluing | Supports precise automated processing. | |
3M Adhesive (Normal) | 3M9448A / 468 / 55236 | Operating temperature -40℃ ~ 160℃. | |
High-temp Adhesive | 3M9077 / Tesa 8853 | Long-term 200℃, short-term up to 240℃. | |
Wire Harness | Standard Wire | Teflon / Silicone wire | Currently only the default wire type is supported.Customer selection, JLC Parts sourcing, or Consign Parts will be supported in the future. |
Panelization | Panel Size | 250 mm × 350 mm / 250 mm × 500 mm | Supports customized panel sizes. |
Spacing & Break Tabs | 2 mm spacing /0.5–0.8 mm break tabs | Convenient for splitting and reducing defects. | |
Panel Soldering / Component Mounting | Per customer requirements | Supports wire attachment and component mounting. | |
Design Files & Guidelines | File Formats | CAD / Gerber / PDF | CAD format recommended; include pad, resistance, and trace direction. |
Power & Dimension Parameters | Provide resistance, voltage, power,target temperature | Converted into standard design drawings using calculation formulas. |
FAQ sur les éléments chauffants flexibles
Quelle est la différence entre un élément chauffant en silicone et un élément chauffant en PI?
Le silicone est plus durable, plus flexible et mieux adapté aux environnements extérieurs ou difficiles. Les éléments chauffants en PI (polyimide) utilisent un film fin en polyimide et sont idéaux pour les applications compactes nécessitant légèreté et contrôle précis de la température.
Les éléments chauffants en silicone offrent généralement une meilleure résistance mécanique, tandis que les éléments chauffants en PI permettent un meilleur contrôle de l’épaisseur et une réponse rapide.
Puis-je passer une commande sans fichier de conception?
Quelle est la tolérance de résistance des éléments chauffants flexibles JLC?
Quels fils sont couramment utilisés pour le brasage sur les éléments chauffants flexibles JLC?
Prenez-vous en charge le brasage de thermostats, de NTC ou de bornes personnalisées?
Existe-t-il une plage de densité de puissance recommandée? Que se passe-t-il si elle est trop élevée?
