Capacités des éléments chauffants flexibles
Capacités des PCB rigides
Capacités des PCB flexibles
Capacités PCBA
Capacités des pochoirs
Capacités de conception PCB
PI
Silicone
Catégorie | Caractéristiques | Capability | Description |
|---|
Materials & Construction | Heating structure | Single-layer heating conductor | Crossovers and multilayer heating conductors are not supported. Multiple independent circuits are supported, with no fixed limit on circuit quantity. |
Circuit fabrication | Etching | PI heaters use etched heating circuits only. The specific etching or laser processing method is selected by the factory according to the order. | |
Heating conductor material | Stainless steel / Brass / Fe-Cr-Al alloy | The same geometric manufacturing limits apply to all three etched conductor materials. | |
Etched metal thickness | 30 μm / 50 μm | This is the thickness of the etched metal foil, not the PI base film or total finished-product thickness. | |
Standard PI film temperature rating | -40°C to 150°C (72 h); short-term maximum 200°C (30 min) | This rating applies to the film material only. For an assembled product with adhesive, lead wires, NTC, or thermostat, the maximum operating temperature is limited by the lowest-rated component. | |
High-temperature PI film rating | -40°C to 250°C (72 h); short-term maximum 280°C (30 min) | Standard and high-temperature PI use the same geometric manufacturing parameters. | |
Flexibility | Bendable; best flexibility among the current product range | Suitable for curved-surface or bent installation, but repeated dynamic flexing is not recommended. | |
Dimensions & Thickness | Finished-product size range | Minimum 10 mm × 10 mm; maximum 1200 mm × 490 mm | Dimensions are evaluated using the minimum bounding rectangle. Both length and width must meet the minimum-size requirement. |
Standard pricing size | Long side of bounding rectangle ≤590 mm | An oversized-product surcharge applies when the long side exceeds 590 mm. A size of 590 mm × 490 mm is not a fixed product format. | |
Standard outline tolerance | Long side ≤300: ±1 mm; >300–600: ±1.5 mm; >600–1000: ±2 mm; >1000–1200: ±3 mm | The tolerance tier is determined by the longer side of the product's minimum bounding rectangle. Laser cutting is excluded. | |
Laser-cut outline | Outline tolerance up to ±0.3 mm; maximum bounding dimension ≤470 mm | The cut edge may show blackening. The factory determines the processing method according to internal rules; it is not a customer-selectable option. | |
Finished thickness tolerance | ±0.1 mm | The same ±0.1 mm tolerance applies to PI heaters with or without adhesive. A high-precision tolerance of ±0.03 mm is not guaranteed. | |
Custom shapes | Regular and irregular outlines supported | Supported geometries include circles, rings, sectors, trapezoids, irregular contours, internal cutouts, multiple holes, slots, and open notches. | |
Circuit Design | Minimum trace width | 0.25 mm | Applies to etched stainless steel, brass, and Fe-Cr-Al heating circuits. |
Minimum trace spacing | 0.25 mm | Measured as the shortest edge-to-edge distance between two heating conductors. | |
Recommended design range | Trace width and spacing are typically 0.25–3.5 mm | Each product must be evaluated according to resistance and routing requirements. Trace width is generally slightly greater than spacing, although spacing may also be slightly greater than trace width. | |
220 V design recommendation | Recommended trace width and spacing ≥1.8 mm | This is an engineering design recommendation for 220 V applications and does not replace the minimum manufacturing capability. | |
Heating conductor to outline | ≥1 mm | Measured from the conductor edge to the nominal finished-product outline. The customer does not need to add outline dimensional tolerance to this clearance. | |
Pads | Minimum pad opening | 2 mm × 2 mm | This is the coverlay opening for soldering, not the metal pad size. |
Metal overlap around opening | ≥0.5 mm on each side | The opening must lie completely within the metal pad. A connected breakout trace may continue beyond the pad. | |
Typical minimum metal pad | Typically ≥3 mm × 3 mm | Derived from the minimum opening and metal overlap. The actual pad is not required to be rectangular. | |
Metal pad to outline | ≥1 mm | Measured from the metal pad edge to the nominal finished-product outline. | |
Metal pad to non-connected conductor | ≥1 mm | Measured from the metal pad edge to a non-connected conductor edge. This limit does not apply to the breakout trace connected to the pad. | |
Metal pad to metal pad | ≥1 mm | Measured as the shortest edge-to-edge distance between two metal pads. No separate opening-to-opening requirement is specified. | |
Holes & Slots | Minimum finished round-hole diameter | Ø1 mm | Calculated using the finished-hole diameter. |
Minimum internal closed-slot width | 1 mm | Applies to elongated and irregular holes; measured at the narrowest point of the slot contour. | |
Minimum open edge-notch width | 1.5 mm | Applies to notches connected to the product outline; measured at the narrowest point. | |
Finished hole to outline | ≥1 mm | Measured as the shortest distance from the finished-hole edge to the nominal finished-product outline. | |
Finished hole to heating conductor | ≥1 mm | Measured from the finished-hole edge to the heating-conductor edge. | |
Hole size tolerance | ±1 mm | Applies to round-hole diameter and the specified width of irregular holes or slots. | |
Hole position tolerance | ±1 mm | Defined separately from the hole size tolerance. | |
Electrical & Testing | Resistance tolerance for JLC-designed orders | Etched ≥1 Ω: ±5%; etched <1 Ω: ±8% | Measured at room temperature by connecting the instrument directly to the metal pads. Soldered lead-wire resistance is excluded. This tolerance definition has been confirmed. |
Customer-supplied drawing orders | Produced to the drawing; actual resistance tested on every piece | The customer circuit is not recalculated. Target resistance and heating performance of a customer-designed circuit are not guaranteed. | |
Resistance inspection | 100% in-process resistance testing + outgoing sampling inspection | An internal QC report is retained. The outgoing QC report normally shows test data for 5 pcs per batch and is not provided for every individual unit by default. | |
Theoretical free-air temperature assessment | Based on 25°C ambient, still air, unbonded installation, no thermal insulation, and no forced-air cooling | The result is a theoretical reference and does not guarantee operating temperature under the customer's actual installation conditions. | |
Product Options | Pressure-sensitive adhesive | 3M 9448A / 468 / 55236 / 9077; Tesa 8853 | All listed adhesives can be used with PI. Refer to the selected model notes on the quotation page for temperature rating and price. |
Default lead wires | UL 3239 silicone wire / UL 1332 PTFE wire; red/black | Lead-wire length is selected by the customer. | |
Silicone sleeve | Maximum length 2 m | The 2 m limit applies only to the sleeve, not to the maximum lead-wire length. | |
NTC | SMD NTC is generally recommended; probe-type NTC is also supported | Select a part from the component library whenever possible. A JLCPCB Parts number may also be submitted for solderability review. | |
Coverlay and openings | Custom pad and component openings supported | Circuit transfer, alignment lamination, and custom openings are supported. The specific process is arranged by the factory. | |
Files & Panelization | Customer upload formats | DXF / DWG / Gerber / PDF / JPG / PNG | Customer files are reviewed by engineering and converted into internal production files. |
Recommended production panel sizes | 250 mm × 350 mm / 250 mm × 500 mm | The customer submits a single-piece file and the factory completes production panelization. Internal unit spacing and breakaway-tab parameters are not published. |
FAQ sur les éléments chauffants flexibles
Quelle est la différence entre un élément chauffant en silicone et un élément chauffant en PI?
Le silicone est plus durable, plus flexible et mieux adapté aux environnements extérieurs ou difficiles. Les éléments chauffants en PI (polyimide) utilisent un film fin en polyimide et sont idéaux pour les applications compactes nécessitant légèreté et contrôle précis de la température.
Les éléments chauffants en silicone offrent généralement une meilleure résistance mécanique, tandis que les éléments chauffants en PI permettent un meilleur contrôle de l’épaisseur et une réponse rapide.
Puis-je passer une commande sans fichier de conception?
Quelle est la tolérance de résistance des éléments chauffants flexibles JLC?
Quels fils sont couramment utilisés pour le brasage sur les éléments chauffants flexibles JLC?
Prenez-vous en charge le brasage de thermostats, de NTC ou de bornes personnalisées?
Existe-t-il une plage de densité de puissance recommandée? Que se passe-t-il si elle est trop élevée?
