Möglichkeiten für flexible Heizelemente
Fertigungskapazitäten für starre Leiterplatten
Flex-PCB-Fertigungsmöglichkeiten
PCBA-Fertigungskapazitäten
Schablonen-Fertigungsmöglichkeiten
PCB-Layout-Möglichkeiten
PI
Silikon
Category | Feature | Capability | Description |
|---|
Material & Stack-up | Heater Structure | Single-layer structure | Single-layer heating circuit, suitable for most applications. |
Material Type | Stainless steel / Copper (Brass) / FeCrAl | Laminated onto PI (Polyimide) substrates; available in 30μm / 50μm thickness. | |
PI SubstrateTemperature Resistance | -70℃ ~ 200℃; -40 ~ 300℃ (High-temperature resistant PI film) | Suitable for most medium-to-high temperature applications. | |
Dimensions & Thickness | Finished Product Size Range | Max 1200 mm × 490 mm
Min 10 mm × 10 mm
Tolerance is within ±0.5mm to ±1.0mm | Standard size is 590 mm × 490 mm; custom sizes supported up to 1200 mm × 490 mm.
Tolerance is within ±0.5mm to ±1.0mm. |
Substrate Thickness Tolerance | ±0.05 mm (limit ±0.03 mm) | Tolerance range for total material thickness measurement. | |
Circuit Processing | Etching Method | Dry film + LDI imaging / Laser etching | Laser etching suitable for alloy materials; high efficiency and precision. |
Min. track width and spacing | 0.25 mm | PI heater supports a minimum line width and spacing of 0.25 mm, ensuring circuit accuracy and reliability. | |
Min. pad size | 2 mm × 2 mm | Pad opening size should match the trace width and is intended for lead wire soldering. | |
Min. Track to outline clearance | 1mm | Prevents damage to traces during laser or die-cut processing and ensures edge strength. | |
Min. Pad to outline clearance | 1mm | Ensures mechanical strength of solder pads and prevents pad lifting near the edge. | |
Min. Hole to outline clearance | 1mm | Prevents insufficient edge strength after drilling and avoids tearing or deformation. | |
Min. Pad to track clearance | 1mm | Avoids thermal damage or short circuits during soldering or high-temperature operation. | |
Min. Pad to pad clearance | 1mm | Prevents solder bridging and improves soldering and electrical reliability. | |
Resistance Testing | Flying probe / Precision instrument full test | Ensures precision and reliability of the circuit. | |
Resistance Tolerance | ±5% | Resistance values are controlled within ±5% to ensure consistent heat output. | |
Finished Features | Hole Size Range | ≥Φ1 mm | Formed by laser or die-cutting; hole diameter tolerance is ±0.05 mm. |
Diameter Tolerance | ±0.05 mm | Recommended to keep openings at least 0.5 mm away from circuit traces. | |
Cover Layer Lamination | Laser alignment + automatic lamination | Supports window area defined in customer files. | |
Outline Cutting | Laser cutting / Die-cutting | Edge clearance ≥0.3 mm; tolerance ±0.1 mm (high-precision ±0.05 mm). | |
Wire Soldering / Glue Dispensing | Manual / Laser soldering
Automatic / Manual gluing | Supports precise automated processing. | |
3M Adhesive (Normal) | 3M9448A / 468 / 55236 | Operating temperature -40℃ ~ 160℃. | |
High-temp Adhesive | 3M9077 / Tesa 8853 | Long-term 200℃, short-term up to 240℃. | |
Wire Harness | Standard Wire | Teflon / Silicone wire | Currently only the default wire type is supported.Customer selection, JLC Parts sourcing, or Consign Parts will be supported in the future. |
Panelization | Panel Size | 250 mm × 350 mm / 250 mm × 500 mm | Supports customized panel sizes. |
Spacing & Break Tabs | 2 mm spacing /0.5–0.8 mm break tabs | Convenient for splitting and reducing defects. | |
Panel Soldering / Component Mounting | Per customer requirements | Supports wire attachment and component mounting. | |
Design Files & Guidelines | File Formats | CAD / Gerber / PDF | CAD format recommended; include pad, resistance, and trace direction. |
Power & Dimension Parameters | Provide resistance, voltage, power,target temperature | Converted into standard design drawings using calculation formulas. |
Häufige Fragen zu flexiblen Heizelementen
Worin besteht der Unterschied zwischen einem Silikon-Heizelement und einem PI-Heizelement?
Silikon ist langlebiger, flexibler und für Außenbereiche oder raue Umgebungen geeignet. PI-Heizelemente (Polyimid) verwenden dünne Polyimidfolie und sind ideal für kompakte Anwendungen, die eine leichte Bauweise und präzise Heizsteuerung erfordern.
Silikonheizer bieten im Allgemeinen eine höhere mechanische Festigkeit, während PI-Heizer eine bessere Dickenkontrolle und schnelle Reaktionszeiten bieten.
Kann ich eine Bestellung ohne Designdatei aufgeben?
Welche Widerstandstoleranz haben flexible Heizelemente von JLC?
Welche Kabel werden üblicherweise zum Löten an flexiblen JLC-Heizelementen verwendet?
Unterstützen Sie das Löten von Thermostaten, NTCs oder kundenspezifischen Anschlüssen?
Gibt es einen empfohlenen Bereich für die Leistungsdichte? Was passiert, wenn sie zu hoch ist?
