This website requires JavaScript.
クーポン

フレキシブルヒーター対応能力

リジッドPCBの製造能力
フレキシブルPCBの製造能力
PCBAの対応能力
ステンシルの対応能力
PCBレイアウト能力
ポリイミドフレックスヒーター
シリコーン
Category
Feature
Capability
Description

Material & Stack-up

Heater Structure
Single-layer structure
Single-layer heating circuit, suitable for most applications.
Material Type
Stainless steel / Copper (Brass) / FeCrAl
Laminated onto PI (Polyimide) substrates; available in 30μm / 50μm thickness.
PI SubstrateTemperature Resistance
-70℃ ~ 200℃; -40 ~ 300℃ (High-temperature resistant PI film)
Suitable for most medium-to-high temperature applications.

Dimensions & Thickness

Finished Product Size Range
Max 1200 mm × 490 mm Min 10 mm × 10 mm Tolerance is within ±0.5mm to ±1.0mm
Standard size is 590 mm × 490 mm; custom sizes supported up to 1200 mm × 490 mm. Tolerance is within ±0.5mm to ±1.0mm.
Substrate Thickness Tolerance
±0.05 mm (limit ±0.03 mm)
Tolerance range for total material thickness measurement.

Circuit Processing

Etching Method
Dry film + LDI imaging / Laser etching
Laser etching suitable for alloy materials; high efficiency and precision.
Min. track width and spacing
0.25 mm
PI heater supports a minimum line width and spacing of 0.25 mm, ensuring circuit accuracy and reliability.
Min. pad size
2 mm × 2 mm
Pad opening size should match the trace width and is intended for lead wire soldering.
Min. Track to outline clearance
1mm
Prevents damage to traces during laser or die-cut processing and ensures edge strength.
Min. Pad to outline clearance
1mm
Ensures mechanical strength of solder pads and prevents pad lifting near the edge.
Min. Hole to outline clearance
1mm
Prevents insufficient edge strength after drilling and avoids tearing or deformation.
Min. Pad to track clearance
1mm
Avoids thermal damage or short circuits during soldering or high-temperature operation.
Min. Pad to pad clearance
1mm
Prevents solder bridging and improves soldering and electrical reliability.
Resistance Testing
Flying probe / Precision instrument full test
Ensures precision and reliability of the circuit.
Resistance Tolerance
±5%
Resistance values are controlled within ±5% to ensure consistent heat output.

Finished Features

Hole Size Range
≥Φ1 mm
Formed by laser or die-cutting; hole diameter tolerance is ±0.05 mm.
Diameter Tolerance
±0.05 mm
Recommended to keep openings at least 0.5 mm away from circuit traces.
Cover Layer Lamination
Laser alignment + automatic lamination
Supports window area defined in customer files.
Outline Cutting
Laser cutting / Die-cutting
Edge clearance ≥0.3 mm; tolerance ±0.1 mm (high-precision ±0.05 mm).
Wire Soldering / Glue Dispensing
Manual / Laser soldering Automatic / Manual gluing
Supports precise automated processing.
3M Adhesive (Normal)
3M9448A / 468 / 55236
Operating temperature -40℃ ~ 160℃.
High-temp Adhesive
3M9077 / Tesa 8853
Long-term 200℃, short-term up to 240℃.

Wire Harness

Standard Wire
Teflon / Silicone wire
Currently only the default wire type is supported.Customer selection, JLC Parts sourcing, or Consign Parts will be supported in the future.

Panelization

Panel Size
250 mm × 350 mm / 250 mm × 500 mm
Supports customized panel sizes.
Spacing & Break Tabs
2 mm spacing /0.5–0.8 mm break tabs
Convenient for splitting and reducing defects.
Panel Soldering / Component Mounting
Per customer requirements
Supports wire attachment and component mounting.

Design Files & Guidelines

File Formats
CAD / Gerber / PDF
CAD format recommended; include pad, resistance, and trace direction.
Power & Dimension Parameters
Provide resistance, voltage, power,target temperature
Converted into standard design drawings using calculation formulas.

フレキシブルヒーターに関するよくある質問

シリコーンヒーターとPIヒーターの違いは何ですか?

シリコーンは耐久性が高く、柔軟性に優れ、屋外や過酷な環境での使用に適しています。PI(ポリイミド)ヒーターは薄いポリイミドフィルムを使用しており、軽量性と精密な加熱制御が求められるコンパクトな用途に最適です。
シリコーンヒーターは一般的に機械的強度が高く、一方、PIヒーターは厚みの制御性に優れ、応答速度が速いという特徴があります。

デザインファイルがなくても注文できますか?

JLCのフレキシブルヒーターの抵抗許容誤差はどのくらいですか?

JLCのフレキシブルヒーターのはんだ付けには、一般的にどのようなワイヤーが使われますか?

サーモスタット、NTC、または特注端子の半田付けに対応していますか?

推奨される電力密度の範囲はありますか?もし高すぎたらどうなりますか?

今すぐフレキシブルヒーターのプロジェクトを始めましょう